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H61M-E33 (B3)

Từ khóa

Mainboard , MSI , LGA 1155 , H61

H61M-E33 (B3)

  • Intel® H61 Chipset, Supports Intel® Sandy Bridge processors in LGA1155 package
  • - Dual channel DDR3 1066/1333 DRAM, 16GB Max , DIMM slot : 2
  • - VGA + DVI + HDMI Max Share Memory 1024 MB, 8-channel audio with Realtek® ALC887
  • - 1x PCI Express gen2 x16 slot, 2 PCI Express gen2 x1 slots , 1 x PCI slots, 4 x SATA II,  4 x USB 2.0, LAN 10/100/1000 Fast Ethernet by Realtek 8111E, M-ATX Form Factory

Technical Specifications
 
 
CPU
Supports Intel® Sandy Bridge processors in LGA1155 package
Chipset
Intel® H61 (B3) Chipset
Memory
Supports two unbuffered DIMM of 1.5 Volt DDR3 1066/1333 DRAM, 16GB Max
Audio
Chipset integrated by Realtek® ALC887
- Flexible 8-channel audio with jack sensing
- Compliant with Azalia 1.0 Spec
LAN
Supports one PCI Express LAN 10/100/1000 Fast Ethernet by Realtek 8111E
On-Board SATA
SATAII controller integrated in Intel® H61 (B3) chipset
Slots
- 1 PCI Express gen2 x16 slot
- 3 PCI Express gen2 x1 slots
- 1 PCI slot, support 3.3V/ 5V PCI bus Interface
Internal I/O Connectors
- ATX 24-Pin power connector
- 4-pin ATX 12V power connector 
- CPU x 1 / System x 2 FAN connectors
- CD-in connector
- Front panel audio connector
- Front panel connector
- 1 x chasis intrusion connector
- 3 x USB 2.0 connectors
- 4 x Serial ATAII connectors
- 1 x Clear CMOS jumper
- 1 x SPDIF-out connector
- 1 x TPM module connector
- 1 x Serial port connector
- 1 x Parallel port connector
Back Panel I/O Ports
- 1 x PS/2 Mouse/Keyboard port
- 4 x USB 2.0 ports
- 1 x HDMI port
- 1 x Graphic Card port 
- 1 x DVI-D port
- 1 x RJ45 LAN Jack
- 1 x 6 in 1 audio jack
Dimension
24.5cm(L) x 21.5cm(W) M-ATX Form Factor
 

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